Promote your Business / Blog / Idea on ORKUT...... FREE

After status update, suggested friends, chat, SMS, widgets etc features, here comes one more important and most awaited feature orkut ‘promote’: a free tool to help you spread the news to all your orkut friends…and beyond!

Now marketers, bloggers can invest their time in tweaking the ad copy to impress Orkut users, to drive traffic, leads and sales.

When you first create a promotion, only your friends will be able to see it. Once they click on “promote it!”, their friends can see it.. and so on.

To see the number of clicks, views, Promotions, Trashes, goto “promote”, then click on “my promotions” tab.



Ad format support:

For content creation, it supports Text, Image or YouTube Video. Text also supports the regular scrap markup, and is limited to 200 characters.

Only images that you have uploaded to Orkut and which is set to public viewing can be used. You can stop or delete a promotion that you’ve created at any time.

How to make your promotional content VIRAL?

It is obvious that, the content that you are showcasing must be interesting. Along with that, you have to have friends who you actually know. If you just add every friend request and have no idea of who it is, then you most probably will not receive vote for your content(ad).

On the other hand, if you have 1000 active, and known friends your content will go VIRAL very soon.

1. If you are a blogger, you can find 1000 blog readers in Orkut and send them friend request. After they have accepted the friend request, you can use your blog logo and good ad copy to promote your blog/product/service/business.

2. Publish your “Orkut Promotion ads” on your blog, so that your readers are familiar with the ad copy, and can vote for you when they see it in Orkut.

3. Remember, there are more Asians and Brazilian citizens using Orkut, so language also counts. It depends on who you are targeting and more importantly who your friends are.

New things to be expected from Orkut:

1. Algorithm to track people who are trying to game the system.

2. Ability to create a Vanity URL for our profile.

3. Indexable by search engines(except the data which is set private)

Down side:

Also expected

1. More spammers.

2. More scammers, telling that they will make your ad to be shown to millions of Orkut users.

3. More and more people wasting their time trying to game the system.

Do not ignore the potential of promoting your business on Orkut. For more details of Orkut users, you can have a look at their advertise page.

If you are presently seeing adsense ads, then remember, Orkut Promote is used by both advertisers and orkut users. You can advertise on Orkut using AdWord also(which costs money).

Do you already have a strategy to make your content(ad) go viral on Orkut?

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How to add Latest Posts Title as Subject of E-Mail

Most awaited feature of feedburner is now live.

How it feels to see 10 to 20 emails with the same subject line/title and from the same person? Even if the content of the mail is different we get irritated to open it and read. Many times, when we are busy and want to clean/process the inbox, we just delete such mails.

Feedburner used to send a static subject line with all the email updates. But now they have added a feature, using which we can customize the email Subject line and make it more meaningful.

Use ${latestItemTitle} to insert your latest post’s title into the Subject/Title of email.

If we have multiple blog posts?

With two or more items in the update, ${n} shows the total number of items, and ${m} shows the number of items beyond the latest.

Examples

Infosqueeze: ${latestItemTitle}

Infosqueeze: “${latestItemTitle}” plus ${m} more

Infosqueeze: (in this message: ${n} new items)

To activate this, log into your feedburner account. Click on “Publicize” tab. Next, look for “Email Subscriptions (Offer feed updates via email)” link at the left side side bar, click on it. A number of sub-menu items will be shown, among them, click on “Email Branding” link. Now you can follow the above tips to customize the email title/subject line. Actually those tips are given by feedburner on the customization page itself.

Thanks Feedburner.. also fix the chicklet count fluctuation problem!
If you are a blogger, make sure you make use of this feature and stop annoying your email subscribers!

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How an Intel Processor is Made

Sand, Made up of 25 percent silicon, is, after oxygen, the second most abundant chemical element that's in the earth's crust. Sand, especially quartz, has high percentages of silicon in the form of silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.

After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.

A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent.

The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.

Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing- ready wafers from third-party companies. Intel’s advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip.

The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin.

At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button.

Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other.

A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern.

In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin.

After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point.

The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals.

After the etching, the photo resist is removed and the desired shape becomes visible.

More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.

Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph).

After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted.

This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors.

The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.

The copper ions settle as a thin layer on the wafer surface.

The excess material is polished off leaving a very thin layer of copper.

Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be “wired” is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel’s Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.

This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer."

After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies).

The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies.

This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor.

The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation.

A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story.

During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).

Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications.

The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story.

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